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SEM/EDX Analysis​ Other Products

OM images of the cross-sectional solder part at X54 magnification​
SEM Measurement of Sample (Area 1A) at X25,000 magnification
SEM Measurement of Sample (Area 1B) at X25,000 magnification
PRODUCT DETAIL

TREND can assist our customers to do SEM/EDX analysis
for intermetallic compound (IMCs) at the solder joint​ Interface of their sample.​


If you would like to know details of the equipment,
please contact