Inline PCBA AOI for SMT Components (3D) To inspect defects of SMT components and solder 3D imaging, minimizing shadow problems

Core Advantages
・ Intelligently remove noise with depth map. Solve distortion problem in 3D imaging.
・ Measurement height can be configured, meeting a variety of inspection requirements
・ Dynamic self-adoption reference plane algorithm to calibrate substrate height
・ Multi-frequency four-step phase algorithm to strengthen robustness, avoiding influence of illumination changing imaging