Our unique flow system adopting Pascal principle delivers control capability to gain consistent solder temperature and flow heights of multiple soldering nozzles. Continuous head gap flow ensures heat transfer to soldering points to gain good soldering quality. Robot cylinders are employed at the PCB lifting-and-lowering drive section and the peel-back drive section to achieve the optimal soldering conditions. 45° lifting peel-back method is effective for spot soldering arranged in X and Y directions.