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ULTIMA-II
ULTIMA-MINIROBO
TAKU-ROBO
AST-330
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Our unique flow system adopting Pascal principle delivers control capability to gain consistent solder temperature and flow heights of multiple soldering nozzles. Continuous head gap flow ensures heat transfer to soldering points to gain good soldering quality. Robot cylinders are employed at the PCB lifting-and-lowering drive section and the peel-back drive section to achieve the optimal soldering conditions. 45° lifting peel-back method is effective for spot soldering arranged in X and Y directions.


2. Monitor
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Its file facility (200 files) improves production control.

Specification List
AST-330
PCB size MIN
20(W)x50(L)mm
MAX
250(W)x330(L)mm
Thickness
0.8~2.0mm
Component Height
50mm or less from Top
15mm or less from Bottom
Lead Wire Length
3mm or less
PCB setting method
Stage type (Allowance : 3mm or more)
Path Line Height
100010mm
Solder Bath Material
SUS316L Kanuc Surf Treatment
Solder Bath Heating Method
Indirect Heating System
Solder Capacity
Approx. 440kg (SG:7.3)
Power Supply
3-phase 200V 17KVA
Dimensions
850(L)x1150(W)x1400(H)mm
Weight
Approx. 350kg (Solder not included)


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