MDR SeriesWS Series
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Ceramic treatment is provided to the inside of the solder bath made of a special casting with heat & corrosion resistance. The surface treatment with corrosion resistance is provided to the nozzle and the duct. The heater can be mounted from outside.

The solder capacity is reduced to 300kg by about 33% of that of our existing machine, which achieves a significant reduction of the initial cost and solder replacement cost.
Attachment and removal of impeller parts have been simplified (One-touch operation type), which reduces maintenance time and increases maintenance frequency to help the machine keep the best conditions.

Improvement of the nozzle and the duct, and adoption of the liquid level lowering controller have contributed to minimum generation of oxide dross (Actual value is 2.5kg/8h). This enables you to greatly reduce the running cost.
The distance between the nozzles of the first wave and the second wave has been minimized (20mm), and the temperature depression has been prevented as much as possible. The outside peel-back point adjustment unit (an optional unit, patent pending) enables lead-free solder to shape the optimal wave profile without externally stopping the flow.
Standard Equipment
  • Main Conveyor
  • Pre-heater
  • Solder Bath
  • Solder Bath Roll-out Unit (Manual)
  • Cooling Fan (Blower)
  • Inlet Feeder (Chain Conveyor)
  • Outlet Feeder (Chain Conveyor)
  • Finger Cleaner
  • Main Control Unit
  • Emergency Stop Switch
  • Solder Bath Upper Panel Lamp
  • Optional Equipment
  • Outside Peel-back Point Adjustment Unit
  • Warp-prevention Units (in Solder Bath and Pre-heater)
  • PCB Cooling Unit
  • Dross Separation Unit
  • Automatic Solder Supply Unit
  • Pre-heater Extender
  • Temperature Controller for Pre-heater 2
  • Intermittent Flow Controller
  • Foaming Fluxer Unit (Flux Controller)
  • UPS
  • Auto Fire Extinguisher
  • Duct Shutter
  • Path Line Changer
  • Signal Tower
  • Unit for different voltage
  • Hot Air Combination Use Pre-heating Unit


  • Specification List
    WS-302LF
    WS-401LF
    PCB size MIN
    50(W)x120(L)mm
    50(W)x120(L)mm
    MAX
    300(W)x350(L)mm
    400(W)x450(L)mm
    Thickness
    1.0mm~2.0mm
    1.0mm~2.0mm
    Component Height
    80mm
    80mm
    Lead Length
    6mm
    6mm
    Conveyor Angle
    4.5°
    4.5°
    Transport Finger
    Ultra Heat-resistant Resin Finger
    Ultra Heat-resistant Resin Finger
    Solder Bath Roll-out
    Manual
    Vertically : Automatic
    Anteroposteriorly : Manual
    Solder Bath Roll-out Direction
    Backside
    Backside
    Built-in Spray (Option)
    NA
    NA
    N2 Atmosphere (Option)
    NA
    NA
    Soldering Condition Input
    NA
    NA
    Pre-heater
    Sheath Heater
    Sheath Heater
    Solder Bath Replacement (Option)
    NA
    NA
    Solder Bath Material
    Special Cast Metal Ceramic Treatment
    Special Cast Metal Ceramic Treatment
    Solder Bath Heating Method
    Indirect Heating System
    Indirect Heating System
    Solder Capacity
    300kg (SG:7.3)
    440kg (SG:7.3)
    Power Supply
    3-phase 200V 27KVA
    3-phase 200V 36KVA
    Air Source
    4~5kgf/cm2
    4~5kgf/cm2
    Dimensions
    3700(L)x1220(W)x1448(H)mm
    3730(L)x1350(W)x1375(H)mm
    Weight
    Approx. 1000kg
    Approx. 1500kg

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