MDR SeriesWS Series
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The outside adjusting system for "peel-back point" can control the solder flow speed and the angle of detachment of PCBs from the solder surface without stopping solder flow. This system is very effective for bridgeless and fillet-up soldering, enabling stable control of soldering quality even when lead-free solder is used. The attached "setting value check gauge" also realizes reproducibility of the set values.

Easy replacement with a spare solder bath enables the combined use of lead-free solder and currently-used Sn-Pb eutectic solder.
N2 supply system has improved operability and maintainability of the machine by employing a newly developed gnitrogen tunnel structureh, effectively reducing oxide dross of lead-free solder. (The machine can be easily modified from air spec. to N2 spec.)

The coating unit of spray fluxer (VIS-350, able to handle VOC-free) can be built in as an optional extra. Its high coating efficiency can realize even spray coating without soiling the machine.
The PCB Cooling Unit can resolve lead-free soldering quality troubles, such as SMT land lifting and shrinkage cavity.
Standard Equipment
  • Main Conveyor
  • Pre-heater
  • Solder Bath
  • Solder Bath Roll-out Unit (Automatic)
  • Cooling Fan
  • Inlet Feeder (Chain Conveyor)
  • Outlet Feeder (Chain Conveyor)
  • Finger Cleaner / Intermittent Flow Controller
  • Main Control Unit
  • Emergency Stop Switch
  • Optional Equipment
    N2 Middle(Full) Closed Tunnel Structure+ Mist Collection Unit
  • Outside Peel-back Point Adjustment Unit
  • Warp-prevention Unit (in Solder Bath and Pre-heater)
  • PCB Cooling Unit
  • Spare Solder Bath (With carriage : Option)
  • Built-in Spray Fluxer
  • Dross Separation Unit+ Automatic Solder Supply Unit
  • Foaming Fluxer Unit (Flux Controller)
  • Auto Width-adjustment Unit
  • UPS
  • Auto Fire Extinguisher
  • Duct Shutter
  • Path Line Changer
  • PCB Production Counter
  • Signal Tower
  • Unit for different voltage

  • Specification List
    MDR/MDF-250
    MDR/MDF-350
    PCB size MIN
    50(W)x120(L)mm
    50(W)x120(L)mm
    MAX
    250(W)x350(L)mm
    350(W)x450(L)mm
    Thickness
    1.0mm~2.0mm
    1.0mm~2.0mm
    Component Height (in N2 atmosphere)
    100mm or less (50mm or less)
    100mm or less (50mm or less)
    Lead Length
    6mm or less
    6mm or less
    Conveyor Angle
    3~4°
    3~4°
    Transport Finger
    Ultra Heat-resistant Resin Finger
    Ultra Heat-resistant Resin Finger
    Solder Bath Roll-out
    Automatic
    Automatic
    Solder Bath Roll-out Direction
    Foreside/Backside
    Foreside/Backside
    Built-in Spray
    Option
    Option
    N2 Atmosphere
    Option
    Option
    Soldering Condition Input
    200 Files
    200 Files
    Pre-heater
    Far-infrared Panel Heater
    Far-infrared Panel Heater
    Solder Bath Replacement
    Option
    Option
    Solder Bath Material
    Special Cast Metal Ceramic Treatment
    Special Cast Metal Ceramic Treatment
    Solder Bath Heating Method
    Indirect Heating System
    Indirect Heating System
    Solder Capacity
    300kg (SG:7.3)
    300kg (SG:7.3)
    Power Supply
    3-phase 200V 34KVA
    3-phase 200V 34KVA
    Air Source
    4~5kgf/cm2
    4~5kgf/cm2
    N2 Supply Amount
    20m3/H
    20m3/H
    Dimensions
    4440(L)x1300(W)x1334(H)mm
    4440(L)x1400(W)x1334(H)mm
    Weight
    Approx. 1050kg
    Approx. 1150kg

    Specification List
    MDR-460
    PCB size MIN
    50(W)x120(L)mm
    MAX
    460(W)x500(L)mm
    Thickness
    1.0mm~2.0mm
    Component Height (in N2 atmosphere)
    100mm or less (50mm or less)
    Lead Length
    6mm or less
    Conveyor Angle
    3~4°
    Transport Finger
    Ultra Heat-resistant Resin Finger
    Solder Bath Roll-out
    Automatic
    Solder Bath Roll-out Direction
    Foreside
    Built-in Spray
    NA
    N2 Atmosphere
    Option
    Soldering Condition Input
    200 Files
    Pre-heater
    Far-infrared Panel Heater
    Solder Bath Replacement
    Option
    Solder Bath Material
    Special Cast Metal Ceramic Treatment
    Solder Bath Heating Method
    Indirect Heating System
    Solder Capacity
    350kg (SG:7.3)
    Power Supply
    3-phase 200V 34KVA
    Air Source
    4~5kgf/cm2
    N2 Supply Amount
    27m3/H
    Dimensions
    4440(L)x1500(W)x1334(H)mm
    Weight
    Approx. 1200kg

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