A range of epoxy based adhesives ensures extremely stable hi-speed dispensability whilst significantly improving bonding strength. Adhesives suitable for low curing temperature and printing applications are also available.

Product Curing condition Shelf life (0-10°C) Application Pdf
JU-50UF 130°C x
10 min.
3 mo. Underfill for SMT process
Halogen free product
High osmosis ability
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(coming soon)
JU-R2S Preheat:
x100 sec.
Reflow temp:
above 220°C
x45 sec.
6 mo. Adhesive for SMT process
Self alignment effect with lead free solder
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JU-100-2LH 130°C x
60 sec.
Halogen free product
Stable dispensability
PDF icon
(coming soon)
JU-90LT 90-100°C x
100 sec.
Low temperature curable product PDF icon
JU-100-5 130°C x
60 sec.
Excellent dispensability for low to high speed dispensing PDF icon
130°C x
60 sec.
Excellent printing with high dot profile PDF icon

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