Soldering Materials
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Newly developed flux systems that combine both high-softening point resins and heat-resistant activators successfully realize excellent solderability with minimal flux spattering.
S3X-56M and S03X7Ca-56M have proven to excellent permance not only with SnAg based lead free alloys, but also SnAgBiCu and SnZnBi.
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| Product |
Alloy composition
(melting point) |
Application |
Pdf |
| S3X-56M |
Sn96.5/Ag3.0/Cu0.5
(217-218°C) |
Excellent solderability and workability
Minimized flux spattering
Very low fume |
(415KB) |
| S3X-60NH |
Halogen free
Improved workability |
(coming soon) |
| S03X7Ca-56M |
Sn/Ag0.3/Cu0.7/Co0.03/+a
(217-227°C) |
Low Ag type (low cost)
Anti-soldering iron erosion
Fast and complete wetting |
(671KB) |
| Solder Bar |
Sn96.5/Ag3.0/Cu0.5
(217-218°C)
Sn95.75/Ag3.5/Cu0.75
(217°C)
Sn96.5/Ag3.5 (221°C)
Sn99.3/Cu0.7 (227°C)
etc. |
Various solder alloy lineup
Anti-erosion of iron bit |
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