Koki offers range of high performance lead-free solder pastes with high purity non-oxidized solder powders. Specially developed high temperature resistant no-clean flux systems ensure as high soldering quality as conventional lead containing solder pastes realizing excellent fine pitch and micro components printability, and powerful solderability even in air reflow.
Product Number Grain Size (meltin point) Application Pdf
S3X48-M500

Sn96.5/Ag3/Cu0.5
(217~218°C)

Anti-Pillow Defect
Halogen Free
Low Voiding		 PDF icon
(1,920KB)
S3X48-M406-5 General purposes
Anti-pillow defect
Excellent printability		 PDF icon
(824KB)
S3X58-M650-3 Halogen free
ICT testable
For high speed print		 PDF icon
(513KB)
S3X70-M407-4 For Super fine pitch (0402 Chip)
Grain size: 10~25um		 PDF icon
(1.151KB)
S01X7C48-M500 Sn99.17/Ag0.1/Cu0.7/Co0.03
(217～227°C)		 Low Ag
Anti-pillow defect 		PDF icon
(679KB)
SB6N58-A730-3 Sn90/Ag3.5/Bi0.5/In6
(202～211°C)		 Medium melting point
Anti-crack alloy (High durability)		 PDF icon
(1,467KB)
TB48-M741 Sn42/Bi58
(138°C)		 Low melting point
Anti-Global Warming
(Reduce the emissions of CO2)		 PDF icon
(546KB)

Product Number Grain Size
(melting point)		 Application Pdf
S3X811-NT1

Sn96.5/Ag3/Cu0.5
(217～218°C)

Outstanding stability of smoothening
Ensure consistent amount of solder paste
Grain size: 5~20um		 PDF icon
(coming soon)

Product Number Grain Size
(melting point)		 Application Pdf
S3X-BF70M

Sn96.5/Ag3/Cu0.5
(217～218°C)

For super fine bump size (100μmφ)
High cleaning performance
Customizable as customer?? condition
Grain size: 5～20um		 PDF icon
(coming soon)
S3X-BF200N

Sn96.5/Ag3/Cu0.5
(217～218°C)

For ordinary bump size (250μmφ)
High cleaning performance
Grain size: 20~38um


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