Good and Consistent Wetting Spreading to Oxidized Metal Surface.
After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.
Solder Spreading Property
After continual print, pause 45 min. or 60 min. and resume printing and observe print volume.
・ Stencil : 200μm / 6.5mmφ aperture
・ Pre-conditioning : 150ºC for 16Hr
・ Heat source : Convection reflow
・ Reflow : Air
Superior Wetting Despite Halogen Free Flux Chemistry
In conventional solder paste, activator reacts with the solder powder at room temperature (during the storage) and increases the viscosity of solder paste.Activator in S3X58-HF920 is selected in such a way that it does not react with solder powder at room temperature but activates at elevated temperatures during the reflow process to get superior wetting. As a result, S3X58-HF920 obtains superior wetting ability but the viscosity of the solder paste is not compromised.
Viscosity Stability in Storage
Viscosity and Ti values were found to remain stable for a month’s storage at two different temperatures: 1. below 10°C and 2. at 30°C.
Crack-Free residue technology for reliable auto-applications
No residue washing or coating required
GSP's crack-free flux residue acts as a coating and prevents condensation and contamination at joints. Therefore, residue washing or coating is not needed. The number of processes will be reduced, and significant cost benefit can be anticipated.
Wets lead ends
GSP exerts excellent wettability even to lead ends which are generally not plated and considered poorly wettable and contributes to improving the first time quality.
Reliable insulation in condensing environments
GSP maintains excellent insulation reliability in condensing tests conducted after thermal cycling tests (-40/+125ºC x 1000cycles). GSP's crack-free flux residue prevents moisture absorption to joints, ensuring superb electrical reliability.
Solder the right "Spot".Not "Area" soldering.
Uniformly spherical solder powder
The reason why graping often occurs while using fine particle solder paste is an increase in the amount of oxide layers due to a larger amount of fine particles printed. S3X70-M500D minimizes the amount of oxide layers by selecting fine and spherical solder powders under strict quality checks, in order to retain high meltability.
Consistent deposit shape even in long-term uses
Carefully selected solder powder and flux of highly consistent viscosity in continual use maintain fine print shapes even in long-term uses.
Superbly low voiding for any component
S3X70-M500D is designed to maintain its activity for a long period of time. During reflow, by removing voids in a long span, S3X70-M500D realizes low voiding for any component